Tikamaliza kupangaChithunzi cha PCB, tiyenera kusankha njira mankhwala pamwamba pa bolodi dera.Njira zomwe zimagwiritsidwa ntchito kwambiri pazigawo za boardboard ndi HASL (kupopera tini pamwamba), ENIG (ndondomeko yomiza golide), OSP (anti-oxidation process), ndi malo omwe amagwiritsidwa ntchito kwambiri Kodi tingasankhe bwanji chithandizo?Njira zosiyanasiyana za mankhwala a PCB zili ndi ndalama zosiyana, ndipo zotsatira zomaliza zimakhalanso zosiyana.Mungasankhe malinga ndi mmene zinthu zilili.Ndiroleni ndikuuzeni za ubwino ndi kuipa kwa njira zitatu zosiyana za chithandizo chapamwamba: HASL, ENIG, ndi OSP.
1. HASL (Njira yopoperapo utoto pamwamba pa malata)
Kupopera kwa malata kumagawika kukhala malata opopera otsogolera ndi opopera opanda lead.Njira yopopera tini inali njira yofunika kwambiri yochizira pamwamba m'ma 1980.Koma tsopano, matabwa ochepera ndi ochepa amasankha njira yopopera malata.Chifukwa chake ndi chakuti gulu ladera munjira "yaing'ono koma yabwino kwambiri".Njira ya HASL idzatsogolera ku mipira yosakwanira yogulitsira, gawo la malata a mpira chifukwa chowotcherera bwinoNtchito za PCB Assemblychomera pofuna kufunafuna miyezo yapamwamba ndi ukadaulo waukadaulo wopanga, ENIG ndi SOP njira zochizira pamwamba zimasankhidwa nthawi zambiri.
Ubwino wa malata opopera ndi mtovu : mtengo wotsika, kuwotcherera kwabwino, mphamvu zamakina ndi gloss kuposa malata opopera ndi lead.
Kuipa kwa malata opopera mankhwala: malata owazidwa ndi lead amakhala ndi zitsulo zolemera, zomwe sizigwirizana ndi chilengedwe popanga ndipo sizingadutse zowunika zachitetezo cha chilengedwe monga ROHS.
Ubwino wa kupopera mbewu mankhwalawa popanda malata: mtengo wotsika, kuwotcherera kwabwino kwambiri, komanso wokonda zachilengedwe, amatha kudutsa ROHS ndi kuwunika kwina kwachitetezo cha chilengedwe.
Kuipa kwa kupopera kwa malata opanda lead: Mphamvu zamakina ndi gloss sizowoneka bwino ngati kutsitsi kwa malata opanda lead.
Kuipa kofala kwa HASL: Chifukwa kutsetsereka kwa pamwamba pa bolodi lopoperapo ndi losauka, sikuli koyenera kupangira zikhomo zokhala ndi mipata yabwino ndi zigawo zazing'ono kwambiri.Mikanda ya malata imapangidwa mosavuta mu PCBA processing, zomwe zimapangitsa kuti mabwalo afupikitsidwe apangidwe ndi mipata yabwino.
2. ENIG(Njira yomira golide)
Njira yothira golide ndi njira yapamwamba yochizira pamwamba, yomwe imagwiritsidwa ntchito makamaka pama board ozungulira omwe ali ndi zofunikira zolumikizirana komanso nthawi yayitali yosungira pamtunda.
Ubwino wa ENIG: Sizophweka kuti oxidize, akhoza kusungidwa kwa nthawi yaitali, ndipo ali ndi malo athyathyathya.Ndizoyenera kugulitsa zikhomo zapakatikati ndi zigawo zokhala ndi zolumikizira zazing'ono.Kubwereranso kumatha kubwerezedwa nthawi zambiri popanda kuchepetsa solderability.Itha kugwiritsidwa ntchito ngati gawo lapansi la COB wire bonding.
Zoyipa za ENIG: Mtengo wokwera, mphamvu zowotcherera zosakwanira.Chifukwa njira yopangira nickel yopanda electroless imagwiritsidwa ntchito, ndikosavuta kukhala ndi vuto la disk yakuda.Nickel layer imatulutsa okosijeni pakapita nthawi, ndipo kudalirika kwanthawi yayitali ndi vuto.
3. OSP (anti-oxidation process)
OSP ndi filimu yopangidwa ndi mankhwala pamwamba pa mkuwa wopanda kanthu.Kanemayu ali ndi anti-oxidation, kutentha ndi kukana chinyezi, ndipo amagwiritsidwa ntchito kuteteza pamwamba pa mkuwa kuti asachite dzimbiri (oxidation kapena vulcanization, etc.) m'malo abwino, omwe ali ofanana ndi mankhwala odana ndi okosijeni.Komabe, pambuyo pa kutentha kwapamwamba kwa kutentha, filimu yotetezera iyenera kuchotsedwa mosavuta ndi kutuluka, ndipo poyera mkuwa woyera pamwamba akhoza kuphatikizidwa nthawi yomweyo ndi solder yosungunuka kuti apange mgwirizano wolimba wa solder mu nthawi yochepa kwambiri.Pakalipano, chiwerengero cha matabwa ozungulira pogwiritsa ntchito njira ya mankhwala a OSP chawonjezeka kwambiri, chifukwa ndondomekoyi ndi yoyenera matabwa ozungulira otsika zamakono ndi matabwa apamwamba kwambiri.Ngati palibe kufunikira kwa kulumikizidwa pamwamba pa ntchito kapena kuchepetsa nthawi yosungira, njira ya OSP idzakhala njira yabwino kwambiri yochizira pamwamba.
Ubwino wa OSP:Lili ndi ubwino wonse wa kuwotcherera mkuwa wopanda kanthu.Bolodi yomwe yatha (miyezi itatu) imatha kubwezeretsedwanso, koma nthawi zambiri imakhala nthawi imodzi.
Kuipa kwa OSP:OSP imakhudzidwa ndi asidi ndi chinyezi.Ikagwiritsidwa ntchito pakusokera kwachiwiri, iyenera kumalizidwa mkati mwa nthawi inayake.Nthawi zambiri, zotsatira za soldering yachiwiri reflow adzakhala osauka.Ngati nthawi yosungiramo idutsa miyezi itatu, iyenera kubwerezedwanso.Gwiritsani ntchito mkati mwa maola 24 mutatsegula phukusi.OSP ndi wosanjikiza insulating, kotero mayeso mfundo ayenera kusindikizidwa ndi solder phala kuchotsa original OSP wosanjikiza kukhudzana pini mfundo kuyezetsa magetsi.Kukonzekera kwa msonkhano kumafuna kusintha kwakukulu, kufufuza mkuwa waiwisi kumawononga ICT, ma probe a ICT opitirira nsonga amatha kuwononga PCB, amafuna kusamala, kuchepetsa kuyesa kwa ICT ndikuchepetsa kubwereza mayeso.
Zomwe zili pamwambazi ndikuwunika njira yothandizira pamwamba pa HASL, ENIG ndi OSP matabwa ozungulira.Mukhoza kusankha njira ya mankhwala pamwamba kuti mugwiritse ntchito molingana ndi ntchito yeniyeni ya bolodi la dera.
Ngati muli ndi mafunso, chonde pitaniwww.PCBFuture.comkudziwa zambiri.
Nthawi yotumiza: Jan-31-2022